The Xperia Z2 has been launched by Sony at the MWC 2014 and the device has received much attention because of its some spectacular specs and features. The device is soon to make an entry in the market this April 11, but as the handset has already been out in Taiwan, folks at CNMO.com seem to have checked the device thoroughly and what comes out from the dismantling is the the makers have created an absolute masterpiece!
Here are couple of images showing every detail of the device is close observations.
Click the images to enlarge
The Xperia Z2 has almost the same design like that of its predecessor Xperia Z1 except for the 5.2 inch screen.
The back of the Xperia Z2 is made up of glass with a similar back like that of Xperia Z1
You might need a thin metal bar using which you can pry the bottom. Gently remove the glue and pry the bottom open.
Remember it should be done gently and just don’t be in a hurry! Pry from all sides and remove the back shell.
Your first glimpse at the interiors will get you to a yellow colored battery and the motherboard.
The rear glass panel is thin and delicate. Keep it safe!
A closer look to the motherboard shows it to be covered in tight shielded metal cover.
At the bottom you will see a battery, vibrator and speaker.
Explore further into the device by removing the screws of the metal cover covering the motherboard.
In all there are six cross-head screws to be removed.
The next step includes removing the battery showing ratings like 3200mAh juice, 3.8V and 12.2Wh.
After that you will need to remove other parts to ensure easy removal of the motherboard.
The following picture shows the parts that are to be removed along with the camera.
Take a view at the rear of the motherboard that is covered with metal shield.
Here is a front-view to the motherboard which shows microUSB interface, microSD card slots and micro SIM slots.
Taking a look at the back side after removing the motherboard, you get to see a 3.5mm headphone jack at the top right.
A close up for the Xperia Z2 vibrator and speakers.
Here is an RF antenna cable in order to enhance wireless signals.
Perfect bonding of cables help it to be distinguished properly.
Here is a look at the metal shield that protect the motherboard.
Take a look at the back of the motherboard chip.
At the front on the chip, you will notice some thermal paste covering the chip.
A closer look at the power management IC Qualcomm PM8941
3GB Samsung RAM, clocking at 900MHz.
The TFA 9890 speaker driver that the device sports. It has got an internal boost convertor for better sound clarity.
A look at Samsung’s 16 GB internal storage.
Qualcomm WCD9320 audio decoder
Skyworks SKY77619 multiband multimode power amplifier for Quad Band
Skyworks SKY77753 multiband multimode power amplifier for Penta Band
Qualcomm RF Transceiver
Qualcomm PM8841 is a power management IC.
Qualcomm LTE chip (WTR2100).
Qualcomm QFE1101 is a PA power management chip which is Average Power Tracker and not Envelope Tracker reducing power consumption on 4G networks.
2.2MP front camera.
Micro SIM card slot.
Micro SD memory card slot.
Micro USB interface.
All parts in one place.